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Creep Characteristics of a New Pb-Free Soldering Sn-In Pewter

✍ Scribed by Al-Ganainy, G.S.

Publisher
John Wiley and Sons
Year
2002
Tongue
English
Weight
183 KB
Volume
193
Category
Article
ISSN
0031-8965

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✦ Synopsis

This paper reports the results of a study on the steady-state creep parameters during phase transformation of one of the important pewters, Sn-5.2wt%In, which can be used as a new Pb-free soldering material. This pewter has been studied by tensile creep tests in the temperature range from 70 to 140 C. The results show one transformation temperature (100 C). In the low temperature range (70-100 C), the activation energy Q is dependent on the applied stress s by the relation Q ¼ Q 0 --Vs, where Q 0 (¼79.7 AE 2.1 kJ/mol) represents the total obstacle strength. In the high temperature range, Q is only slightly affected by s and has an average value of 35.8 AE 3.9 kJ/mol which characterizes the grain boundary diffusion mechanism. X-ray diffraction analyses reveal the existence of both the b-Sn rich phase and the intermetallic compound g-InSn4 in the quenched sample, and only mono-phase b-Sn in the slowly cooled one.

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