𝔖 Bobbio Scriptorium

✦ LIBER ✦

Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

✍ Scribed by A. Agwai; I. Guven; E. Madenci

Book ID: 113800481
Publisher: Elsevier Science
Year: 2011
Tongue: English
Weight: 971 KB
Volume: 51
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.05.011

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

The use of small-angle electron scatteri

The use of small-angle electron scattering to compare the structure of craze found in thin films with that found in bulk materials

✍ Brown, H. R. 📂 Article 📅 1983 🏛 Wiley (John Wiley & Sons) 🌐 English ⚖ 715 KB

[IEEE 2012 14th International Conference

[IEEE 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Lantau Island, Hong Kong (2012.12.13-2012.12.16)] 2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Evaluation of the crystallographic quality of electroplated copper thin-film interconnections embedded in TSV structures

✍ Furuya, Ryosuke; Suzuki, Ken; Miura, Hideo 📂 Article 📅 2012 🏛 IEEE ⚖ 643 KB