Cost-Driven Design of Smart Microsystems......Page 2
Contents......Page 8
Preface......Page 12
1 Introduction......Page 14
References......Page 22
2.1. Design Strategies......Page 24
2.2.1. Design Strategies for Digital Circuits......Page 25
2.2.2. Design Strategies for Analog Circuits......Page 27
2.3. Design of Electronic Components and Microsystems......Page 29
2.4. Design of Modules with Heterogeneous Components......Page 32
2.5. Design of Communication Protocols......Page 34
2.6. Design Models for Smart Microsystems......Page 36
References......Page 38
3.1. Semiconductor Technologies......Page 40
3.1.1. Wafer Fabrication......Page 41
3.1.2. Wafer Test......Page 44
3.1.3. Chip Packaging and Class Test......Page 47
3.2. Module Integration Technologies......Page 48
3.2.1. Fabrication of Module Substrates......Page 49
3.2.2. Assembly and Interconnection......Page 54
3.2.3. Passivation and Encapsulation Technologies......Page 67
3.3. Process Modeling......Page 71
References......Page 75
4.1.1. Wiring Capacity of Substrates......Page 80
4.1.2. Module Systems......Page 83
4.2.1. Component Arrangement......Page 88
4.2.2. Component Wiring......Page 90
4.2.3. Ensuring the Signal Integrity......Page 92
4.3. Determination of the Miniaturization Potential......Page 96
4.3.1. Volume Aggregation Lists......Page 97
4.3.3. Adapted Geometry Models......Page 98
References......Page 100
5.1.1. Computing Architectures......Page 102
5.1.2. Implementation of System Functions......Page 107
5.2.1. Sensor and Actuators......Page 108
5.2.2. Processing of Sensor Data......Page 110
5.3.1. Power Consumption of the Functional Components......Page 113
5.3.2. Energy Storage and Power Conversion......Page 114
5.4.1. Radio Architectures......Page 117
5.4.2. Layout of Transmitter and Receiver Circuitry......Page 121
5.5.1. Optimization of Analog Architectural Elements......Page 122
5.5.2. Optimization of Digital Architectural Elements......Page 124
References......Page 127
6.1. Properties of the Surrounding Medium......Page 132
6.1.2. Signal Propagation......Page 133
6.1.3. Interferences......Page 135
6.1.4. Modeling of Environmental Influences......Page 136
6.2. Radio Communications......Page 138
6.2.2. Media Access Schemes......Page 139
6.2.3. Logical Link Control......Page 141
6.2.4. Network Control......Page 143
6.3. Distributed Data Acquisition......Page 145
6.3.1. Localization......Page 147
6.3.2. Synchronization and Calibration......Page 149
6.4. Determination of Functional Optimization Potential......Page 150
6.4.1. Aggregation Lists of System Parameters......Page 151
6.4.3. Adapted System Models......Page 154
References......Page 156
7.1. Basic Cost Categories......Page 160
7.2. Approaches of Cost Estimation......Page 162
7.2.1. Cost Determination of Fabrication Processes......Page 164
7.2.2. Cost Determination of System Components......Page 166
7.3. Direct Component Costs......Page 169
7.3.1. Determination of Cost-Driving Function Components......Page 170
7.3.2. Determination of Costs for Module Integration......Page 171
7.4.1. Development Effort of Hardware......Page 175
7.4.2. Development Effort of Software......Page 176
7.4.3. Generalized Cost Modeling of Development Activities......Page 178
7.4.4. Influence of Expectations......Page 181
References......Page 183
8.1. Model-Based Cost Optimization......Page 186
8.1.1. Determination of Potential Cost Reduction......Page 187
8.1.2. Design Flow......Page 191
8.2. Smart Microsystems with Tailored Architectures......Page 194
8.3. Smart Microsystems with Universal Architectures......Page 201
8.4. Smart Microsystems with Modular Architectures......Page 205
References......Page 208
9.1. Smart Microsystems for Tracking Transport Goods......Page 210
9.1.1. Functional Design Decisions......Page 211
9.1.2. Physical Design Decisions......Page 214
9.2. Smart Microsystems for Condition Monitoring......Page 222
9.2.1. Functional Design Decisions......Page 223
9.2.2. Physical Design Decisions......Page 226
Acronyms and Abbreviations......Page 232
About the Author......Page 236
Index......Page 238