No coin nor oath required. For personal study only.
gain of such calculations is limited. Information on sputtering rates and secondary electron yields from more complicated target materials as for instance oxides are lacking. This might be one of the reasons why the FIB-technique is not as frequently used for imaging as Scanning Electron Microscopy, though the attainable resolution is almost the same.
The chapter "Application of Focused Ion Beams" describes all fields of application known and tried out up to now comprehensively. These are: 1) IC review and modification, 2) TEM sample preparation, 3) Micro-machining, 4) Chemical mapping (FIB/ SIMS-combination), 5) Ion Implantation and 6) FIB-lithography. Though almost all presented examples are related to the semiconductor industry, the detailed descriptions of processes and practical advices are applicable to other material systems as well. The chapters of general interest for a wide field of applications are on: Scanning Ion Microscopy (SIM), cross-sectional FIB-investigation and TEM sample preparation. Though not mentioned explicitly in the book, the latter issues offer fantastic possibilities for gaining new knowledge on numerous yet unsolved questions in all fields of materials science including chemical and structural analysis of corrosion products.
Who should read this book? People who are either engaged or interested in the design of focused ion beam instruments certainly will read it completely, but their number will be small. For users of a FIB instrument the book will provide valuable background information and practical tips which may help during daily work and trouble shooting. For those who are only interested in getting information about successful applications of the FIB-technique, only a small part of the content will be useful. -CB05903 -W. O ¨sterle
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