Correlation between special grain boundaries and electromigration behavior of aluminum thin films

✍ Scribed by K.T. Lee; J.A. Szpunar; A. Morawiec; D.B. Knorr; K.P. Rodbell

• Book ID: 113132084
• Publisher: Canadian Institute of Mining, Metallurgy and Petroleum
• Year: 1995
• Tongue: English
• Weight: 419 KB
• Volume: 34
• Category: Article
• ISSN: 0008-4433
• DOI: 10.1016/0008-4433(95)00015-p