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Corona discharge assisted thermal bonding of polymer microfluidic devices

✍ Scribed by Sum Huan Ng; Yexian Wu; Zhenfeng Wang; Zhiping Wang

Book ID
106185809
Publisher
Springer-Verlag
Year
2009
Tongue
English
Weight
490 KB
Volume
16
Category
Article
ISSN
0946-7076

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## Abstract The effects of thermomechanical properties of dissimilar polymer plates on thermal bonding were investigated and the resultant deformation of cover Topas COC plate was modeled using a simplified quasi‐creep model. The appropriate conditions for thermal bonding for minimal deformation of