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Conventional and microwave-assisted processing of Cu-loaded ICAs for electronic interconnect applications

✍ Scribed by Siyuan Qi, Bala Vaidhyanathan, David Hutt

Book ID: 120677153
Publisher: Springer
Year: 2013
Tongue: English
Weight: 734 KB
Volume: 48
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-013-7537-9

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