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Contact Damage Accumulation in Tic3SiC2

✍ Scribed by It Meng Low; Seung Kun Lee; Brian R. Lawn; Michel W. Barsoum


Book ID
110827440
Publisher
John Wiley and Sons
Year
2005
Tongue
English
Weight
917 KB
Volume
81
Category
Article
ISSN
0002-7820

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πŸ“œ SIMILAR VOLUMES


Ti3SiC2/TiC composites prepared by PDS
✍ S. Konoplyuk; T. Abe; T. Uchimoto; T. Takagi πŸ“‚ Article πŸ“… 2005 πŸ› Springer 🌐 English βš– 1009 KB