✦ LIBER ✦

Constructal design of combined microchannel and micro pin fins for electronic cooling

✍ Scribed by Adewumi, O.O.; Bello-Ochende, T.; Meyer, J.P.

Book ID: 123239193
Publisher: Elsevier Science
Year: 2013
Tongue: English
Weight: 984 KB
Volume: 66
Category: Article
ISSN: 0017-9310
DOI: 10.1016/j.ijheatmasstransfer.2013.07.039

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Combined Numerical Optimization and Cons

Combined Numerical Optimization and Constructal Theory for the Design of Microchannel Heat Sinks

✍ Bello-Ochende, T.; Meyer, J. P.; Ighalo, F. U. 📂 Article 📅 2010 🏛 Taylor and Francis Group 🌐 English ⚖ 811 KB

Combined local microchannel-scale CFD mo

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design

✍ R. Wälchli; T. Brunschwiler; B. Michel; D. Poulikakos 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 673 KB

Microchannel cold plates enjoy increasing interest in liquid cooling of high-performance computing systems. Fast and reliable design tools are required to comply with the fluid mechanics and thermal specifications of such complex devices. In this paper, a methodology accounting for the local as well

[American Institute of Aeronautics and A

[American Institute of Aeronautics and Astronautics 38th AIAA Thermophysics Conference - Toronto, Ontario, Canada ()] 38th AIAA Thermophysics Conference - Performance of Shrouded Pin-Fin Heat Sinks for Electronic Cooling

✍ Khan, Waqar; Culham, Rick; Yovanovich, Milan 📂 Article 📅 2005 🏛 American Institute of Aeronautics and Astronautics ⚖ 375 KB

[IEEE High Density Design Packaging and

[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

✍ Zhong, Xiaolong; Fan, Yi; Liu, Johan; Zhang, Yan; Wang, Teng; Cheng, Zhaonian 📂 Article 📅 2007 🏛 IEEE ⚖ 984 KB

[IEEE ITherm 2002. Eighth Intersociety C

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Experimental analysis of shrouded pin fin heat sinks for electronic equipment cooling

✍ Ho Chul Ryu, ; Duckjong Kim, ; Sung Jin Kim, 📂 Article 📅 2002 🏛 IEEE 🌐 English ⚖ 413 KB