[IEEE High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - (2007.06.26-2007.06.28)] High Density Design Packaging and Microsystem Integration, 2007 International Symposium on - A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array

✍ Scribed by Zhong, Xiaolong; Fan, Yi; Liu, Johan; Zhang, Yan; Wang, Teng; Cheng, Zhaonian

• Book ID: 111896928
• Publisher: IEEE
• Year: 2007
• Weight: 984 KB
• Volume: 0
• Category: Article
• ISBN-13: 9781424412532
• DOI: 10.1109/hdp.2007.4283649