✦ LIBER ✦

Constitutive relation and creep-fatigue life model for eutectic tin-lead solder

✍ Scribed by Knecht, S.; Fox, L.R.

Book ID: 117872735
Publisher: IEEE
Year: 1990
Tongue: English
Weight: 940 KB
Volume: 13
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.56179

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Quick assessment methodology for reliabi

Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model

✍ Shi Xunqing; Wang Zhiping; John HL Pang; Zhang Xueren; Nie Jingxu 📂 Article 📅 2002 🏛 The Chinese Society of Theoretical and Applied Mec 🌐 English ⚖ 827 KB

Fatigue life prediction for low-tin lead

Fatigue life prediction for low-tin lead-based solder at low strains: Vaynman, S. and Zubelewicz, A. Welding J. Oct. 1990 69 (10), 395s–398s

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 174 KB