✦ LIBER ✦

Conditions preventing thermal breakdown in semiconductor devices

✍ Scribed by K. D. Tsendin; A. B. Shmelkin

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Secondary breakdown thermal characteriza

✍ Reich, B.; Hakim, E.B. 📂 Article 📅 1966 🏛 IEEE 🌐 English ⚖ 629 KB

Thermal failure in semiconductor devices

✍ V.M. Dwyer; A.J. Franklin; D.S. Campbell 📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 697 KB

Semiconductor devices under `breakdownÂ¿

✍ Mehra, P.N.; Satyam, M. 📂 Article 📅 1969 🏛 Institution of Electrical Engineers ⚖ 122 KB

Thermal breakdown in silicon p-n junctio

✍ Khurana, B.S.; Sugano, T.; Yanai, H. 📂 Article 📅 1966 🏛 IEEE 🌐 English ⚖ 740 KB

Electrostatic discharge thermal failure

✍ Dwyer, V.M.; Franklin, A.J.; Campbell, D.S. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 576 KB

Selfheating and thermal runaway phenomen

✍ Corneliu Popescu 📂 Article 📅 1970 🏛 Elsevier Science 🌐 English ⚖ 642 KB