𝔖 Bobbio Scriptorium
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Conditioning of a substrate for electroless plating


Book ID
121972325
Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
160 KB
Volume
93
Category
Article
ISSN
0026-0576

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A mechanism for electroless Cu plating o
✍ SebastiΓ£o G. dos Santos Filho; AndrΓ©A. Pasa; Claus M. Hasenack πŸ“‚ Article πŸ“… 1997 πŸ› Elsevier Science 🌐 English βš– 363 KB

In this work the electrochemical mechanism of copper plating on silicon during immersion into diluted hydrofluoric acid (D-HF) solutions is investigated. For that purpose, silicon wafers were immersed for various time intervals into D-HF intentionally contaminated with copper from copper sulphate. T