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Apparatus for electroless plating a contact pad

Book ID
123338134
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
123 KB
Volume
101
Category
Article
ISSN
0026-0576

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πŸ“œ SIMILAR VOLUMES

A mechanism for electroless Cu plating o
A mechanism for electroless Cu plating onto Si
✍ SebastiΓ£o G. dos Santos Filho; AndrΓ©A. Pasa; Claus M. Hasenack πŸ“‚ Article πŸ“… 1997 πŸ› Elsevier Science 🌐 English βš– 363 KB

In this work the electrochemical mechanism of copper plating on silicon during immersion into diluted hydrofluoric acid (D-HF) solutions is investigated. For that purpose, silicon wafers were immersed for various time intervals into D-HF intentionally contaminated with copper from copper sulphate. T