Computer simulation of curing and toughening of epoxy systems
โ Scribed by D. Alperstein; H. Dodiuk; S. Kenig
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 76 KB
- Volume
- 49
- Category
- Article
- ISSN
- 0323-7648
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
Epoxy-terminated poly(phenylene ether ketone) (E-PEK) developed in this Institute is a candidate matrix resin for polymer composites as structural materials. Cure cycles for this reaction system were simulated according to the previously established processing model. It is found that for the E-PEK s
Dynamic mechanical spectroscopy has been used to investigate the cure of a thermoplastically modified trifunctional epoxy resin. The complex dissolution, curing behavior, and variations in the glass transition of the thermoplastic (PSF) phase were described, as was the T g behavior of the epoxy phas