A new shredded pulp-plastic microsphere composite with modified starch binder which is applicable to the packaging of electronic equipment has been developed. This composite with a 3 wt% microsphere content has almost the same compressive stress at 50% compressive strain as that of (poly)styrene foa
Compression and cushioning characteristics of moulded pulp packaging
โ Scribed by John Hoffmann
- Publisher
- John Wiley and Sons
- Year
- 2000
- Tongue
- English
- Weight
- 230 KB
- Volume
- 13
- Category
- Article
- ISSN
- 0894-3214
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๐ SIMILAR VOLUMES
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