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Compounds developed for electronic component encapsulation

Book ID: 117780164
Publisher: Elsevier Science
Year: 2001
Tongue: English
Weight: 249 KB
Volume: 3
Category: Article
ISSN: 1464-391X
DOI: 10.1016/s1464-391x(01)80127-6

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## Applicant: Epcos AG, Germany This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and th