The epoxy resin diglycidyl ether of bisphenol F (DGEBF) was cured by the aliphatic amine curing agent Epicure 3371 in a stoichiometric ratio both frontally and in a batch-cure schedule. Glass transition temperatures ( T g ) were determined using differential scanning calorimetry (DSC) and dynamic me
Comparison of microwave and thermal cure of epoxy–anhydride resins: Mechanical properties and dynamic characteristics
✍ Scribed by Varaporn Tanrattanakul; Kaew SaeTiaw
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 690 KB
- Volume
- 97
- Category
- Article
- ISSN
- 0021-8995
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## Abstract The curing behavior and thermal properties of bisphenol A type novolac epoxy resin (bisANER) with methylhexahydrophthalic anhydride (MHHPA) at an anhydride/epoxy group ratio of 0.85 was studied with Fourier‐transform infrared (FTIR) spectroscopy, differential scanning calorimetry (DSC),
The cure reactions of tetraglycidyl methylene diamine (TGMDA) epoxy cured with tetrasubstituted aromatic diamine on one hand and diglycidyl ether of bisphenol A and diglycicyl ether tetrabromobisphenol A epoxies cured with methylene bis (phenyl-4-cyanate) on the other hand are reported. Systematic F
The curing behavior of diglycidyl ether of bisphenol-A (DGEBA) with aromatic diamines having aryl-ether, aryl-ether-carbonyl, and aryl-ether-sulfone linkages was studied using differential scanning calorimetry (DSC). Aromatic diamines such as 1,3-bis ( aminophenoxy ) benzene ( R ) , 1,4-bis ( aminop