Comparative investigation of TaN and SiCN barrier layer for Cu/ultra low k integration

✍ Scribed by L.Y. Yang; D.H. Zhang; C.Y. Li; R. Liu; P.W. Lu; P.D. Foo; A.T.S. Wee

• Book ID: 108289180
• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 250 KB
• Volume: 504
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/j.tsf.2005.09.166