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Comments on the Behaviour of Dislocations in Intermetallic Compounds at Low Homologous Temperatures

✍ Scribed by P. Paufler


Publisher
John Wiley and Sons
Year
1972
Tongue
English
Weight
137 KB
Volume
52
Category
Article
ISSN
0370-1972

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The oxidation of Cu-Sn intermetallic compounds is of significant technological interest in relation to the wetting behavior of Sn-base solders to Cu and Cu alloys. However, there are very few studies on this subject in the literature. In this present study, oxide films formed on the intermetallic co