Combinatorial fabrication and high-throughput characterization of a Ti–Ni–Cu shape memory thin film composition spread

✍ Scribed by R. Löbel; S. Thienhaus; A. Savan; A. Ludwig

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 800 KB
• Volume: 481-482
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2007.02.168