Effects of molding compound on wire swee
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Tadashi Yoshihara; Yasuhide Ohno; Akinobu Kusuhara; Hiroshi Fujita; Masakatsu Ma
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Article
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1999
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John Wiley and Sons
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English
โ 455 KB
๐ 2 views
Wire sweep, a problem in plastic encapsulated IC packages, is investigated with real encapsulated packages. For the mechanical characteristics of the wire, the wire sweep becomes smaller for a wire with a larger Youngs modulus, as expected [1]. In regard to the characteristics of the molding compoun