Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies. These challenges are addressed by ex
Chip size and performance evaluations of shared cache for on-chip multiprocessor
✍ Scribed by Takahiro Sasaki; Tomohiro Inoue; Nobuhiko Omori; Tetsuo Hironaka; Hans J. Mattausch; Tetsushi Koide
- Publisher
- John Wiley and Sons
- Year
- 2005
- Tongue
- English
- Weight
- 377 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0882-1666
No coin nor oath required. For personal study only.
✦ Synopsis
Abstract
Recent semiconductor technology has made on‐chip multiprocessors with several CPUs and cache memories on a single chip a realistic possibility. Generally, conventional multiprocessor systems with shared memory offer a simple programming model, but need a cache coherency mechanism that may become a system bottleneck. Furthermore, the same data may be cached on two or more caches, which prevents effective cache utilization. The multiport cache is one solution, but when using the conventional multiport memory architecture, the chip size of the multiport cache will increase in proportion to the square of the number of ports. On the other hand, with our proposed hierarchical multiport memory architecture, multiport memory can be implemented with a smaller chip size than by the conventional methods. This paper proposes the shared cache with a hierarchical multiport memory architecture that does not need a coherency mechanism. This paper also presents the results of performance evaluations and chip size estimations. © 2005 Wiley Periodicals, Inc. Syst Comp Jpn, 36(9): 1–13, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/scj.20244
📜 SIMILAR VOLUMES
## Abstract A set of on‐chip spiral inductors with novel inner‐patterned‐ground (IPG) is presented in this article to enhance the broadband performance. By grounding the simple center metal cross, the IPG structure, an additional inner ground path is formed, the input impedance of the spiral induct
## Abstract A 5 GHz‐band voltage‐controlled oscillator employing on‐chip coplanar‐waveguide resonator instead of inductor–capacitor–resonator is proposed, designed, and fabricated in 0.18 μm CMOS technology.The advantages of the proposed VCO are the wider frequency‐tuning range; smaller chip area a