๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Chip corrosion in plastic packages

โœ Scribed by Howard M. Berg; Wayne M. Paulson


Publisher
Elsevier Science
Year
1980
Tongue
English
Weight
770 KB
Volume
20
Category
Article
ISSN
0026-2714

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๐Ÿ“œ SIMILAR VOLUMES


Study of flow visualization in stacked-C
โœ M. Khalil Abdullah; M.Z. Abdullah; S. Kamarudin; Z.M. Ariff ๐Ÿ“‚ Article ๐Ÿ“… 2007 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 669 KB

The stacked-Chip Scale Package (S-CSP) is a new technology that provides high density of the package. It enables to stack the die in a single package. The S-CSP is widely adopted in portable multi-media products. However, the resin flow through a thin surface and wide filling area is of concern. The