✦ LIBER ✦

ChemInform Abstract: Thin-Film High-Temperature Superconductors for Advanced Communications and Electronics

✍ Scribed by A. LAUDER; K. E. MYERS; D. W. FACE

Publisher: John Wiley and Sons
Year: 2010
Weight: 25 KB
Volume: 29
Category: Article
ISSN: 0931-7597
DOI: 10.1002/chin.199850345

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thin-Film High-Temperature Superconducto

Thin-Film High-Temperature Superconductors for Advanced Communications and Electronics

✍ Alan Lauder; Kirsten E. Myers; Dean W. Face 📂 Article 📅 1998 🏛 John Wiley and Sons 🌐 English ⚖ 486 KB 👁 1 views

ChemInform Abstract: High Temperature Su

ChemInform Abstract: High Temperature Superconductor Thin Films: Growth Mechanisms- Interfaces-Multilayers.

✍ SEVERAL AUTHORS SEVERAL AUTHORS 📂 Article 📅 2010 🏛 John Wiley and Sons ⚖ 24 KB

ChemInform Abstract: Evidence for Ubiqui

ChemInform Abstract: Evidence for Ubiquitous Strong Electron-Phonon Coupling in High-Temperature Superconductors.

✍ A. Lanzara; et al. et al. 📂 Article 📅 2010 🏛 John Wiley and Sons ⚖ 32 KB 👁 1 views

ChemInform Abstract: Bulk High Temperatu

ChemInform Abstract: Bulk High Temperature Superconductors for Magnet Applications

✍ A. M. CAMPBELL; D. A. CARDWELL 📂 Article 📅 2010 🏛 John Wiley and Sons ⚖ 25 KB 👁 1 views

ChemInform Abstract: Electrochemical For

ChemInform Abstract: Electrochemical Formation and Microstructure in Thin Films for High Functional Devices

✍ T. OSAKA 📂 Article 📅 2010 🏛 John Wiley and Sons ⚖ 24 KB

ChemInform Abstract: Thermal Stability o

ChemInform Abstract: Thermal Stability of Hexaaluminate Film Coated on SiC Substrate for High-Temperature Catalytic Application.

✍ H. INOUE; K. SEKIZAWA; K. EGUCHI; H. ARAI 📂 Article 📅 2010 🏛 John Wiley and Sons ⚖ 29 KB

1997 mechanical properties, thermal properties mechanical properties, thermal properties D 3000 ## 25 -010 Thermal Stability of Hexaaluminate Film Coated on SiC Substrate for High-Temperature Catalytic Application. -α-SiC-supported porous hexaaluminate films of high thermal stability for applicat