Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films

✍ Scribed by K.J. Kim; N.-E. Lee; M.C. Kim; J.-H. Boo

• Book ID: 117226620
• Publisher: Elsevier Science
• Year: 2001
• Tongue: English
• Weight: 546 KB
• Volume: 398-399
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/s0040-6090(01)01372-4