✦ LIBER ✦
The interface formation and adhesion of metals (Cu, Ta, and Ti) and low dielectric constant polymer-like organic thin films deposited by plasma-enhanced chemical vapor deposition using para-xylene precursor
✍ Scribed by K.S. Kim; Y.C. Jang; H.J. Kim; Y.-C. Quan; J. Choi; D. Jung; N.-E. Lee
- Book ID
- 114085320
- Publisher
- Elsevier Science
- Year
- 2000
- Tongue
- English
- Weight
- 330 KB
- Volume
- 377-378
- Category
- Article
- ISSN
- 0040-6090
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