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Characterizing the temperature dependence of electronic packaging-material properties

โœ Scribed by Chia-Yu Fu; Charles Ume


Book ID
113008355
Publisher
The Minerals, Metals & Materials Society
Year
1995
Tongue
English
Weight
955 KB
Volume
47
Category
Article
ISSN
1047-4838

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Thermal conductive properties of Niโ€“P el
โœ H.F. Zhao; W.Z. Tang; C.M. Li; G.C. Chen; F.X. Lu; Y.H. Cai; H. Guo; R.Q. Zhang; ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 783 KB

Electroless plated SiC p /Al composites with a high thermal conductivity are required for electronic packaging application. In this paper, in-plane thermal conductive properties of SiC p /Al composites with and without electroless plated Ni-P coatings are compared, and influence of various character