✦ LIBER ✦

Characterizing the formation and growth of intermetallic compound in the solder joint

✍ Scribed by Y. G. LEE; J. G. DUH

Book ID: 111534750
Publisher: Springer
Year: 1998
Tongue: English
Weight: 309 KB
Volume: 33
Category: Article
ISSN: 0022-2461
DOI: 10.1023/a:1004499728840

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