Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating

✍ Scribed by Hoe-Rok Jung; Hyuk-Hwan Kim; Won-Jong Lee

• Book ID: 110627062
• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 651 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/bf02692568