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Characterization of polymer matrix and low melting point solder for anisotropic conductive film

โœ Scribed by Yong-Sung Eom; Ji-Won Baek; Jong-Tae Moon; Jae-Do Nam; Jong-Min Kim


Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
356 KB
Volume
85
Category
Article
ISSN
0167-9317

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Electrical and mechanical characterizati
โœ Yong-Sung Eom; Keonsoo Jang; Jong-Tae Moon; Jae-Do Nam; Jong-Min Kim ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 282 KB

For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th