Chemo-rheological characteristics of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder

Electrical and mechanical characterizati

Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

✍ Yong-Sung Eom; Keonsoo Jang; Jong-Tae Moon; Jae-Do Nam; Jong-Min Kim 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 282 KB

For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th