Characterization of Electrically Conductive Adhesives
β Scribed by U. Eitner; T. Geipel; S.-N. Holtschke; M. Tranitz
- Book ID
- 116427217
- Publisher
- Elsevier
- Year
- 2012
- Weight
- 377 KB
- Volume
- 27
- Category
- Article
- ISSN
- 1876-6102
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π SIMILAR VOLUMES
For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th
## Abstract The effects of particle composition and size distribution on the electrical properties of conductive adhesives were studied. Silverβplated glass and silverβplated nickel particles with both narrow (37β44 ΞΌm) and broad (< 44 ΞΌm) size distributions were dispersed in an epoxy matrix. In al