Characterization method of thermomechanical parameters for microelectronic materials

✍ Scribed by O. Perat; J.M. Dorkel; E. Scheid; P. Temple Boyer; Y.S. Chung; A. Peyre-Lavigne; M. Zecri; P. Tounsi

• Book ID: 108361913
• Publisher: Elsevier Science
• Year: 2002
• Tongue: English
• Weight: 247 KB
• Volume: 42
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(02)00060-4