๐”– Bobbio Scriptorium
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Development of conducting adhesive materials for microelectronic applications

โœ Scribed by Sung K. Kang; S. Purushothaman

Book ID
107457978
Publisher
Springer US
Year
1999
Tongue
English
Weight
143 KB
Volume
28
Category
Article
ISSN
0361-5235

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๐Ÿ“œ SIMILAR VOLUMES

Novel conductive adhesives for surface m
Novel conductive adhesives for surface mount applications
โœ Daoqiang Lu; C. P. Wong ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 203 KB

Electrically conductive adhesives (ECAs) have been explored as a tin/lead (Sn/Pb) solder alternative for attaching encapsulated surface mount components on rigid and flexible printed circuits. However, limited practical use of conductive adhesives in surface mount applications is found because of th