✦ LIBER ✦

Challenges and developments of copper wire bonding technology

✍ Scribed by Peisheng Liu; Liangyu Tong; Jinlan Wang; Lei Shi; Hao Tang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

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✍ Toyozawa, K.; Fujita, K.; Minamide, S.; Maeda, T. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 670 KB

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✍ Okikawa, S.; Tanimoto, M.; Watanabe, H.; Mikino, H.; Kaneda, T. 📂 Article 📅 1989 🏛 IEEE 🌐 English ⚖ 575 KB

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✍ Jong-Ning Aoh; Cheng-Li Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 506 KB

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✍ Yeau-Ren Jeng; Sang-Mao Chiu; Pay-Yau Huang; Shiuh-Hwa Shyu 📂 Article 📅 2010 🏛 IEEE 🌐 English ⚖ 223 KB

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✍ Nguyen, L.T.; McDonald, D.; Danker, A.R.; Ng, P. 📂 Article 📅 1995 🏛 IEEE 🌐 English ⚖ 710 KB

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✍ J. Bánkuti; É. Hegyi Farkas; L. Lászlóffy 📂 Article 📅 1987 🏛 Springer-Verlag 🌐 English ⚖ 150 KB