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CCD camera system for use with a streamer chamber

✍ Scribed by S.A. Angius; R. Au; G.C. Crawley; C. Djalali; R. Fox; M. Maier; C.A. Ogilvie; A. Vander Molen; G.D. Westfall; R.S. Tickle

Publisher
Elsevier Science
Year
1988
Tongue
English
Weight
552 KB
Volume
273
Category
Article
ISSN
0168-9002

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High-speed solder bump inspection system
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We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured