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Carrier-Mobility Enhancement via Strain Engineering in Future Thin-Body MOSFETs

✍ Scribed by Nuo Xu; Ho, B.; Andrieu, F.; Smith, L.; Bich-Yen Nguyen; Weber, O.; Poiroux, T.; Faynot, O.; Tsu-Jae King Liu

Book ID: 114572623
Publisher: IEEE
Year: 2012
Tongue: English
Weight: 538 KB
Volume: 33
Category: Article
ISSN: 0741-3106
DOI: 10.1109/led.2011.2179113

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