Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis

✍ Scribed by Yi-Shao Lai; Chin-Li Kao

• Book ID: 110627051
• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 307 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/bf02692556