Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis

✍ Scribed by Yi-Shao Lai; Chin-Li Kao

• Book ID: 107455106
• Publisher: Springer US
• Year: 2008
• Tongue: English
• Weight: 101 KB
• Volume: 37
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-007-0374-3