A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulf
Bridged phosphorylated diamines: Synthesis, thermal stability and flame retarding properties in epoxy resins
✍ Scribed by Klinkowski, Christoph; Wagner, Sebastian; Ciesielski, Michael; Döring, Manfred
- Book ID
- 122879679
- Publisher
- Elsevier Science
- Year
- 2014
- Tongue
- English
- Weight
- 792 KB
- Volume
- 106
- Category
- Article
- ISSN
- 0141-3910
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
A new phosphorus-containing oxirane bis-glycidyl phenylphosphate (BGPP), and a diamine, bis(4-aminophenyl)phenylphosphate (BAPP), were synthesized. Both of these two phosphorus-containing compounds lead to phosphate-containing epoxy resin via curing reaction. The kinetics of the curing reaction of B
China ## SYNOPSIS A new phosphorus-containing oxirane, bis-(3-glycidyloxy) phenylphosphine oxide (BGPPO), was synthesized. Further curing BGPPO with diamine curing agents, dicyanodiamide (DICY), 4,4'-diaminodiphenylmethane (DDM), and 4,4'-diaminodiphenylsulfone (DDS), respectively, resulted in se