Book Review: Analysis of Copper and its Alloys. By W. T. Elwell and I. R. Scholes
β Scribed by G. Kraft
- Publisher
- John Wiley and Sons
- Year
- 1968
- Tongue
- English
- Weight
- 147 KB
- Volume
- 7
- Category
- Article
- ISSN
- 0044-8249
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
measurement of opaque-film thickness by thermal waves intelligent laser soldering inspection and process control rupture testing of electrodeposited copper interconnections (is this a non-destructive evaluation?) -heterodyne holographic interferometry and -"whole wafer" scanning electron microscopy.
In the preface Barnann-Myrback's book (published in 1941) is recommended, but there is no reference to "Methods in Enzymology"(vo1ume 1 appeared in 1955) or to "Hoppe-Seyler/Thierfelder" (whose publication began in 1953), and this is characteristic of the whole book. It is unintelligible why