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Bondability analysis of bond pads by thermoelectric temperature measurements

✍ Scribed by A. Schneuwly; P. Gröning; L. Schlapbach; G. Müller

Book ID
107457688
Publisher
Springer US
Year
1998
Tongue
English
Weight
647 KB
Volume
27
Category
Article
ISSN
0361-5235

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Thermoelectric measurements for bondabil
Thermoelectric measurements for bondability analysis of bond pads: a new concept for a bondability analyser
✍ Gröning, P.; Schwaller, P.; Schneuwly, A.; Schlapbach, L. 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 404 KB 👁 1 views

We present a new apparatus to determine the ultrasonic wire bonding behaviour of different contact materials. The basic principle of the developed bondability analyser is measurement of the temperature at the bond ball during the ultrasonic friction process by using a thermocouple instead of a bond