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Bond Strength and Microstructural Investigation on Si3N4/Si3N4 Joint Bonded with Glass–ceramic

✍ Scribed by Rongjun Xie; Liping Huang; Xiren Fu

Book ID
110239555
Publisher
Springer
Year
1998
Tongue
English
Weight
145 KB
Volume
17
Category
Article
ISSN
0261-8028

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A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin