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Atomistic simulations of grain boundary migration in copper

✍ Scribed by B. Schönfelder; G. Gottstein; L. S. Shvindlerman

Book ID: 107441030
Publisher: The Minerals, Metals & Materials Society
Year: 2006
Tongue: English
Weight: 526 KB
Volume: 37
Category: Article
ISSN: 1073-5623
DOI: 10.1007/s11661-006-0118-7

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