Association of Bonding-Wire Displacement With Gas Bubbles in Plastic-Encapsulated Integrated Circuits

✍ Scribed by Hunter, W.

• Book ID: 117911674
• Publisher: IEEE
• Year: 1987
• Tongue: English
• Weight: 842 KB
• Volume: 10
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/tchmt.1987.1134759