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Association of bonding-wire displacement with gas bubbles in plastic-encapsulated integrated circuits : William L. Hunter. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 327 (1987)


Book ID
103281524
Publisher
Elsevier Science
Year
1988
Tongue
English
Weight
127 KB
Volume
28
Category
Article
ISSN
0026-2714

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