Association of bonding-wire displacement with gas bubbles in plastic-encapsulated integrated circuits : William L. Hunter. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-10, 327 (1987)

• Book ID: 103281524
• Publisher: Elsevier Science
• Year: 1988
• Tongue: English
• Weight: 127 KB
• Volume: 28
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(88)90029-7