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[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites

✍ Scribed by Pashayi, Kamyar; Fard, Hafez Raeisi; Lai, Fengyuan; Plawsky, Joel; Borca-Tasciuc, Theodorian


Book ID
125456524
Publisher
ASMEDC
Year
2011
Weight
476 KB
Category
Article
ISBN
0791854973

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