SiC thick films of about 300 mm could be prepared with a deposition rate above 300 nm/s by thermal plasma physical vapor deposition (TPPVD) using ultrafine SiC powder as a starting material. The thermoelectric properties were investigated as a function of composition and doping content. The nondoped
β¦ LIBER β¦
Applications of wear-resistant thick films formed by physical vapor deposition processes
β Scribed by Kazuo Nakamura; Konosuke Inagawa; Kazuyuki Tsuruoka; Souji Komiya
- Publisher
- Elsevier Science
- Year
- 1977
- Tongue
- English
- Weight
- 756 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0040-6090
No coin nor oath required. For personal study only.
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