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Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems

✍ Scribed by J. Frömel; D. Billep; T. Geßner; M. Wiemer


Publisher
Springer-Verlag
Year
2005
Tongue
English
Weight
304 KB
Volume
12
Category
Article
ISSN
0946-7076

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